The Chip-Max RoHS Rdy. Chipmaster system is a reliable SMT Component PCB rework and repair system, suitable for small to medium PCB assemblies, BGA and SMT components, requiring Profile Temperature Control.

Wide Ranging
The Chip-Max RoHS Rdy. Chipmaster PCB repair system covers a wide range of SMT components providing a controlled PCB rework environment, which cares for your repair process. The system features a simple operation with automatic “Timed” process control and selected thermal BGA profiling.

Energy Rework Reflow
What makes the Chip-Max RoHS Rdy. Chipmaster different from other Hot Air SMT rework machines is “CONVECTION POWER.” Its high-power heater reworks sensitive components at original Convection Oven temperatures.

Lead Free Rework
Oven Temperature Convection Rework is critical when reworking Lead Free components. The SMT component reflow temperature is higher for Lead- Free materials but the heat source should be kept to an optimum convection temperature to avoid damaging surrounding SMT components. Replicating the manufacturing method using a convection hot air reflow technology is the safest method.

Solder Integrity
The Chip-Max RoHS Rdy. offers a superior quality solder junction when operating at Low Temperatures.

Chipmaster Rework Temperature
At the original Convection Oven Temperature integrity of solder remains intact.

Common Low Power Rework Temperatures
With air temperatures greater than the original Convection Oven Temperature the integrity of solder begins to break down.

Motorola Part Number R1438A